XRF (O SERIES)- BOWMAN

Origin: America

Brand:

Category:

The O Series combines high performance and ultra-small x-ray spot size (80μm FWHM) using poly-capillary optics, which maximize x-ray flux for higher sensitivity and faster testing of small components or thin coatings. Unlike traditional collimators, this system retains nearly 100% of the tube flux, ensuring superior repeatability in shorter test times. It features a high-resolution SDD detector, 55x video magnification, 7x digital zoom, and a programmable X-Y stage. Due to its close focal distance, samples must be flat. Now available with an extended stage option for greater flexibility.

MODEL: XRF O SERIES

SPECIFICATION

X-ray excitation: 50 W W-target with Capillary Optics @80um FWHM at 17 KeV
Detector: Large window Silicon drifted detector with 190eV resolution or better
Number of analysis layers and elements: 5 layers (4 layers + base) and 10 elements in each layer with composition analysis of up to 30 elements simultaneously
Filters/Collimators: 4 primary filters
Output Focal Depth: Fixed at 0.1″ (2.54mm)
Digital Pulse Processing: 4096 CH digital multi-channel analyser with flexible shaping time Automatic signal processing including dead time correction and escape peak correction
Computer: Intel CORE i5 9th gen. desktop processor, solid state hard drive, 16GB RAM, Microsoft Windows 11 Professional 64bit equivalent
Camera optics: 1/4″ (6mm) CMOS-1280×720 VGA resolution
Video Magnification: 55X Micro with 7X Digital Zoom
Power Supply: 150W, 100-240 volts, with frequency range of 47Hz to 63Hz
Working Environment: 68°F (20°C) to 77°F (25°C) and up to 98% RH, non-condensing
Weight: 52-70kg
Programmable XY: Table size: 330mm (13″) x 381mm (15″)| Travel: 127mm (5″) x 152mm (6″)
Now available with optional extended stages or enclosed chamber
Internal Dimensions: Height: 140mm (5.5″), Width: 305mm (12″), Depth: 330mm (13″)
External Dimensions: Height: 457mm (18″), Width: 457mm (18″), Depth: 610mm (24″)

PRODUCT VIEWED

The Bowman L Series is a versatile XRF instrument with a large sample chamber (22″ x 24″ x 13″) and 10″ x 10″ X-Y stage travel. It accommodates large parts or multiple samples and includes a 4-position collimator assembly, variable focus camera, and programmable X-Y stage. The chamber Z-height is 10″ (or 13″ without the stage). It features an SDD detector and a long-life micro-focus X-ray tube.

The W Series Micro XRF from Bowman features a 7.5 µm FWHM X-ray beam, the smallest in the world for coating thickness analysis using XRF technology. This makes it ideal for measuring small components like BGAs and solder bumps. It includes a dual-camera system with 140X magnification for precision imaging and a secondary camera for live viewing. A programmable X-Y stage with ±1 µm accuracy, along with pattern recognition and auto-focus, enables precise measurements and automated multi-point analysis. The system also offers 3D mapping for coating topography visualization. Standard configurations include a molybdenum anode tube (with optional chromium or tungsten) and a high-resolution Silicon Drift Detector. The instrument can measure up to five coating layers simultaneously and operates with Archer software, which streamlines measurement, reporting, and application setup.

The Chotest VX3030D is a high-precision, non-contact flash measuring machine designed for rapid and accurate dimensional analysis across various industries, including electronics, automotive, medical devices, and precision manufacturing. It employs advanced visual measurement principles combined with precision image analysis algorithms to deliver fast, one-click measurements.

The Flash Measuring Machine VX8306D by Chotest Technology Inc. is a high-speed, high-precision optical measurement system designed for non-contact 2D and 2.5D dimensional inspection. It’s commonly used in precision industries such as electronics, automotive parts, plastic injection, and small mechanical components.

The A Series MICRO XRF is designed for precise measurement of the smallest X-ray features in semiconductors and microelectronics. The system supports large PCBs and wafers of any size, with a 7.5 μm FWHM X-ray beam—the smallest in the world for XRF. A dual-camera system with 140X magnification provides detailed imaging, while a programmable X-Y stage moves up to 600 mm with ±1 μm precision. Pattern recognition, auto-focus, and 3D mapping optimize measurement accuracy.