Nano 3D Optical Surface Profilometers SuperView W3 – CHOTEST

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Dedicated Functions for Semiconductor Field

  • Measure profile trenches after laser grooving in the dicing process.
  • Measure film step-height of wafer ranging from 1nm~1mm.
  • Measure roughness of silicon cut sheet after grinding process, and can measure
  • dozens of small areas to obtain the average value by one click.
  • Support 6″, 8″ and 12″ wafer measurement, and easy switch between 3 sizes of
  • vacuum chucks by one click automatically.

Description

SuperView W3 Optical 3D Surface profilometer is an ideal instrument for sub-Nanometer measurement of various precision parts. Based on the principle of white light interference technology, combined with precision Z-direction scanning module and 3D modeling algorithm, it contactlessly scans the surface of the object then establish a 3D image for the surface. A serial of 2D, 3D parameters  reflecting surface quality of the object are obtained after XtremeVision software processes and analyzes the 3D image. The SuperView W3 is a user-friendly precision optical instrument with powerful analysis functions for all kinds of surface form & roughness parameters. With unique light source it could measure various precision parts with both smooth and rough surface.

Parameters

Model No. SuperView W3
Size 1000*900*1550mm
Weight 500 kg
Light source White LED
Video system 1024×1024
Objective Lens 10x(2.5x,5x,20x,50x,100x optional)
Optical Zoom 0.5x(0.75x,1x,0.375x optional)
Standard F.O.V. 0.98×0.98 mm
Lens Turret Motorized 5 holes-turret
XY Object table Size 450×450mm
Travel Range 300×300mm
Loading Capacity 10kg
Control Method Motorized
Tilt ±5° Motorized
Z Axis Travel Range 100mm
Control Method Motorized
Z-Stoke Scanning Range 10mm
Z Resolution 0.1nm
Roughness RMS Repeatability *1 0.005nm
Stage Height Measurement Accruacy *2 0.3%
Repeatability *2 0.08% 1σ
Enviromental Requirement
1 Operating environment: No strong magnetic field 4 Environmental vibration: VC-C or better
2 Working temperature: 0 °C~30°C fluctuation <2℃/60min 5 Compressed air: 0.6Mpa oil-free, water-free
3 Relative humidity: 5%~95% RH, no condensation 6 Power: 300W

Remark:
*1 Measure Sa 0.2nm silicon wafer in a laboratory environment according to the ISO 25178
*2 Measure standard 5 μm steps height block in a laboratory environment according to the ISO 10610-1:2009

 Applications

It is used for measurement and analysis of surface roughness and profile of precision components from industries of semi-conductor, 3C Electronics, ultraprecise machining, optical machining, micro-nano materials, micro-electro-mechanical system.

Measurement and analysis for various products, components and materials`surface form and profile characteristics, such as flatness, roughness, waviness, appearance, surface defect, abrasion,corrosion, gap, hole, stage, curvature, deformation, etc.

3C Electronics_Sapphire crystal

3C Electronics _ Ink screen

PRODUCT VIEWED

Dedicated Functions for Semiconductor Field Measure profile trenches after laser grooving in the dicing process. Measure film step-height of wafer ranging from 1nm~1mm. Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click. Support 6″, 8″ and 12″ wafer measurement, and...